• Maximum board size is 10.5" X 8" or 260mm X 200mm

• Minimum recommended trace width is 10mil or 0.25mm

• Milling tool diameter is 0.20mm (8mil) any clearances between copper that are less than 8 mill will not be cut!

• 12mil or 0.30mm recommended distance between all wires/pads/via

• 10mil recommended minimum distance between all copper

• Bottom layer only is preferred

• Always use a "copper pour" for the ground layer

• Text on the bottom or top layer must be on the same layer as the copper if you want it to be included on the board (same layer as the traces/pads)

Check out this video of the trace milling process: LPKF Milling